Embedded Computing Design

During embedded world Germany, Kudelski Labs revealed that Axelera AI integrated the Kudelski Secure Enclave, robust to AVA_VAN.3 (“KSE3”) into Europa, its new Edge AI processing platform. The joint effort strengthens Europa’s security architecture, ensuring advanced inference workloads can be executed with assurance across rigorous edge environments such as smart infrastructure, industrial automation, and autonomous robotics.

Bosch Sensortec’s ultra-low power, high-performance BMP585 barometric pressure sensor now supports the Snapdragon Wear Elite Platform and is integrated into the Snapdragon Wear Elite Platform’s reference design. The platform delivers on-device AI capabilities with precise pressure data that allows for accurate altitude tracking and a new layer of contextual awareness for next-generation wearables.

Sundance Multiprocessor Technology Ltd (Sundance) announced its SMT135-C, an Efinix Titanium Ti135 evaluation board based on the SoM6 Ti135 system-on-module (SoM) built around the Efinix Titanium Ti135 FPGA, in a N676 package.

Cincoze presents its rugged DX-1300 compact (242 × 173 × 75 mm) industrial computer, the latest addition to its DIAMOND product line. The platform leverages the Intel Arrow Lake-S platform Core Ultra 200S processor and features an integrated CPU, GPU, and NPU hybrid computing architecture delivering up to 36 TOPS of AI power with support for up to 96GB of 6400 MHz DDR5 CSODIMM memory.

IBASE Technology Inc. introduced the palm-sized fanless edge computing system, the ASB100-PI800, leveraging the Intel Atom x7433RE processor and built on the IBASE PI800 PICO-ITX board. The ASB100-PI800 delivers consistent energy efficient computing performance for space-constrained and low-power industrial IoT applications.

Tria Technologies introduced two wireless modules, the SPB611 and SPB209, both supporting multiple short-range protocols and helping to speed up the development of wireless-enabled embedded systems. The SPB611 delivers Wi-Fi 6 (802.11ax 80 MHz) dual-band and Bluetooth 5.2, while the SPB209 offers Wi-Fi 5 (802.11ac) and Bluetooth 4.2. The SPB611 offers a tri-radio option to add 802.15.4-2020 (Thread and ZigBee) mesh networking capabilities. To reduce the size of the system, both modules can be supplied with an LTE filter and PCB antenna.

While attending embedded world Germany, Trenz Electronic showcased ten new FPGA-based platforms including seven AMD-based and three Altera-based solutions. Highlighted were a range of solutions from cost-optimized FPGA platforms to high-I/O designs, RF signal processing, and edge AI applications.

VIA Labs, Inc. (VLI) introduced the industrial grade VL819i USB 5Gbps and VL822i 10Gbps Hub Controllers offering reliable, high-bandwidth operation for applications including machine vision, high-performance peripherals, displays, data acquisition, storage, and general connectivity. The solutions are ideal for environments in a temperature range from -40°C to +85°C.

element14 announced a competition in which the company is inviting engineers, makers, and technology entrepreneurs to enter their smart industry designs focused on production monitoring, uptime optimization, and product testing. If selected, contestants will develop and create a prototype utilizing a kit of components from industry leaders. Per the press release, entries will be judged on creativity and the imaginative use of component features.

Aetina Corporation is attending NVIDIA GTC 2026 to showcase its high-precision 3D vision technology and enterprise-grade Generative AI agents moving robots and automation systems toward end-to-end autonomy. Highlighted will be the DeviceEdge AIB-AT78/68 series edge supercomputing platform powered by NVIDIA Jetson Thor, and modular NVIDIA MGX Edge Servers with NVIDIA NIM microservices support.

Wincomm officially released its new flagship fanless industrial panel PC series featuring the 15” WTP-9K66-15 and the 21.5” WTP-9K66-22. The series was recently honored with the 2026 Taiwan Excellence Award, earned for Wincomm’s innovations in performance, hygiene, and sustainability for smart manufacturing and the food-pharma industries. The platforms leverage the latest Intel Core Ultra 125U processor and highlight a hybrid CPU/NPU/GPU architecture, delivering up to 22.5 TOPS AI performance at only 15 W power consumption. For secure, enterprise-grade management, the PCs incorporate TPM 2.0 on board and support Intel vPro Technology.

STMicroelectronics announced it is integrating its portfolio for advanced robotics into the reference set of components compatible with the NVIDIA Holoscan Sensor Bridge (HSB). In addition, NVIDIA Isaac Sim models of ST components will be incorporated into both companies’ robotics environments allowing faster, more accurate sim-to-real research and development. The goal is to accelerate global expansion of physical AI systems, including humanoid, industrial, service, and healthcare robots.

Advantech will attend NVIDIA GTC 2026 from March 16–19 in San Jose, California. The company will be in Booth #1134 and Meeting Rooms #6077 and #6078 where it will highlight and discuss its edge AI innovations powered by NVIDIA Jetson Thor and NVIDIA IGX Thor. Exhibit features will include how physical AI and edge AI are supporting real-world deployments across robotics, medical systems, smart logistics, and intelligent retail environments.

Axiomtek introduced its DSP522, a 40 mm slim fanless digital signage player leveraging the 13th Gen Intel Core i5‑1335UE or Intel Processor U300E. The platform supports up to four independent 4K UHD displays via HDMI 2.1 (TMDS) providing enhanced visual performance, energy efficiency, and dependability. The onboard MCU facilitates Fixed EDID to uphold stable resolution, even when used with matrix switches or during system reboots. A cable-lock design prevents accidental disconnections.

Sfera Labs announced the new M.2 LTE Module X2-Series Expansion Board (X2BW10XM2Z), a swappable expansion board that adds always-on LTE cellular connectivity and GNSS positioning to its Strato Pi Max XL and XS servers. It is ideal for deployments where connections to wired Ethernet or Wi-Fi are not desirable.  

Hilscher announced two new PC cards for secure industrial communication based on the netX 90 system-on-chip (SoC). The cifX PCIE90-RE and the cifX LPCIE90-RE are available in PCI Express and low-profile PCI Express form factors.

TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.

APLEX Technology Inc. thanks everyone who visited and supported it during embedded world Germany. During the show APLEX demonstrated its new ATEX explosion-proof solutions, including panel PCs, displays, and AVoIP (Audio and Video Over Internet Protocol) box.

BeagleBoard.org announced its BeagleBadge, a limitless innovation platform that brings a new vision to wearables and low-power computing. BeagleBadge follows the company’s central values of access, literacy, ownership, and longevity, ensuring users the tools needed to create. It delivers rapid prototyping, research, and real-world solutions in health, environmental monitoring, and human-machine interfaces.

Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.