Embedded Computing Design

1NCE launched its Certified Integrators Program (CIP) that is aimed to empower external software developers to integrate seamlessly with 1NCE’s IoT platform. According to the press release, 1NCE equips integrators with tools to deliver streamlined, cost-effective IoT implementations for businesses across many verticals.

AAEON introduced its uCOM-IMX8P, an adaptable SMARC 2.1 compliant CPU module built on the NXP i.MX 8M Plus platform with an 82mm x 50mm SMARC form factor to utilize RISC architecture. The solution leverages the NXP i.MX 8M Plus’ Quad-Core Arm Cortex-A53 processor with an integrated NPU, an operating temperature range from -40°C ~ 85°C, and 4GB of onboard LPDDR4 memory and up to 128GB eMMC storage (default SKU: 16GB).

Knowles Corporation will reveal its innovative audio technologies at CES 2025 at the Venetian Resort, Toscana Suite #3801. Visit and learn more about the solutions benefiting hearing health, true wireless stereo (TWS), open wearable stereo (OWS), and audiophile applications. The exhibit will also include Knowles balanced armature (BA) drivers that have been integrated in the JLab Epic Sport ANC 3 and the Breggz ZOHN-1 custom earbuds.

sureCore recently announced a series of cryogenic IP in 180 nm and 22nm process nodes. It is collaborating with Sarcina, which developed a package that can withstand cryogenic temperatures. sureCore’s Static Random Access Memory (SRAM) has a temperature range from 77K (-196°C) down to near absolute zero that is essential for Quantum Computers (QCs).

IC’Alps and SEALSQ Corp. are collaborating further with the goal of innovating the expansion of custom quantum-resistant chips. IC’Alps’ ASIC design knowledge and SEALSQ’s security technology will combine to modernize production and look to evolve business opportunities.
 

CEA-Leti released it has achieved a milestone by integrating a scalable hafnia-zirconia ferroelectric capacitor platform into the back-end-of-line (BEOL) of the 22nm FD-SOI technology node making ferroelectric RAM (FeRAM) a formidable memory solution for cutting-edge nodes. Ferroelectricity in HfO2-based thin films are CMOS compatible and scalable while opening innovation for embedded FeRAM.

Taipei, Taiwan. IBASE Technology Inc. announced the IB996 Full-Size CPU Card leveraging the 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors. It follows the PICMG 1.3 standard and includes the Intel Q670E chipset for enhanced performance and flexibility. The IB996 supports up to 64GB of DDR5 memory with dual DIMM slots and enhanced networking ability with two Intel 2.5G LAN ports.

Active Silicon introduced its rugged Oncilla family of industrial machine vision computers powered by the Intel Alder Lake processor and includes16GB DDR5 SDRAM memory, multiple expansion options, and extensive I/O. The first models are the CoaXPress, Camera Link, and the palm-sized Oncilla Mini.

DFI launched the RAP310, a high-performance microATX industrial motherboard developed for everyday industrial computing, AI applications, and medical image systems. 

Virtium has acquired Embedded Artists, headquartered in Sweden, to enhance Virtium’s offerings within edge computing, artificial intelligence, and high-performance industrial computing markets.

Taipei, Taiwan. APLEX Technology Inc., enjoying its 20th anniversary, announced its ARCHMI-S series of fanless industrial HMI products. Included is the Intel Celeron J6412 powered ARCHMI-S-8B that integrates the benefits of both the ARCHMI and AUHMI series. The HMI is available with multiple screen sizes ranging from 7” TFT-LCD to 21.5” TFT-LCD. Included is two USB 3.2 Type A, two USB 2.0 Type A, two COM, one DP port, and two GbE LAN. DDR4 3200MHz SO-DIMM memory up to 32GB, one Mini-PCIe expansion slot and one M.2 E-Key for Wi-Fi/ Bluetooth module are supported.

Apertis 2024 is now available. Apertis is an OS platform for the x86-64, arm64, and arm32 architectures based on Debian and includes an operating system, tools, and cloud services to enhance development consistency. The collaborative platform is ideal for industrial embedded devices and is utilized in both the Atari VCS game console and the Bosch D-Tect 200 wall scanner. Apertis targets industrial embedded devices with new features including support for Podman, ONNX Runtime, OP-TEE, and more.

Flex Power Modules introduced the BMR352, a non-isolated fully regulated DC/DC converter delivering high power in a quarter-brick form factor. Also announced was the compact BMR316, a non-isolated, unregulated DC/DC intermediate bus converter (IBC) developed for AI and ML data center applications.

AAEON released the MXM-ACMA-PUC leveraging a range of 13th Generation Intel Core CPUs up to 35W, with the default processor being the 16 core, 24 thread Intel Core i7-13700TE. It includes an integrated MXM-ACMA module, offering either an embedded Intel Arc A370E or Intel Arc A350E GPU. The MXM-ACMA-PUC supports four LAN ports, (three running at 2.5GbE, and one at 1GbE), two USB 3.2 Gen 2, and two COM ports with RS-232/422/485 functionality.

ADATA announced it is partnering with Advantech to innovate AI and high-performance computing (HPC) with a new series of servers consisting of the SKY-721E3, SKY-821E3, SKY-622G4 MGX, and SKY-722V4. All are integrated with ADATA’s industrial-grade memory.  

Fremont, California. Delta announced Delta Intelligent Building Technologies (DIBT) and labels it as a one-stop shop for smart and sustainable building solutions for North American clients. On December 1, 2024, subsidiaries Amerlux LLC and Delta Controls, Inc. integrated with DIBT, with their company names changing to Delta Intelligent Building Technologies (USA), LLC and Delta Intelligent Building Technologies (Canada), Inc.

To accelerate consumer AI vision, AMobile has employed MediaTek's IoT development platform leveraging the Genio 510 chipset delivering next-generation edge AI processing such as DLA (Deep Learning Accelerator) and VPU (Vision Processing Unit). Ideal applications include AI image analysis systems and intelligent security.

GÖPEL electronic's announced its newest integration of embedded JTAG solutions for the SPEA 3030 DualCore in-circuit tester (ICT) specifically designed for high-volume manufacturing enabling concurrent processing of multiple UUTs with two ICT core executing test sequences simultaneously. Each core has integrated SCANFLEX II BLADE 8 RMx1-A/B/C with inputs including JTAG, SWD, SBW, BDM, and PIC.

Avalue Technology Inc. introduced its AIB-NINX-S, AIB-NINX-SC, AIB-NIAO-S supporting integrated AI SDK, HW, and I/O leveraging the NVIDIA Jetson family. The devices were developed for applications such as AI edge computing, AGV/AMR, defect inspection, traffic monitoring, and medical imaging where object or face detection is needed.

Lanner introduced its ECA-6051, a 2U short-depth edge AI server leveraging NVIDIA MGX reference architecture and NVIDIA’s GH200 Grace Hopper Superchip for 5G edge AI inference. It was developed to enable efficient data transmission with real-time analysis utilizing high bandwidth 5G connectivity.