Embedded Computing Design

Cincoze released its scalable DIN-Rail computer series, MD-3000, the first sku of the Machine Computing MAGNET product line. The MD-3000 series is designed for vision-driven smart manufacturing applications.

Siemens and GlobalFoundries (GF) will collaborate with the goal of leveraging both companies’ AI-based abilities to enhance performance of semiconductor manufacturing. The companies will emphasize automation technologies for semiconductor fabrication (fab automation), electrification, digital solutions, and software ranging from chip development to product lifecycle management.

Cirrus Logic released its new family of closed-loop haptic drivers, its CS40L51, CS40L52, and CS40L53, the company’s first haptic driver solutions compliant with AEC-Q100 automotive standard. The released solutions are moving Cirrus Logic’s proficiency within consumer electronics to automotive applications with the goal of bringing more consistency to in-cabin interfaces.

Arteris, Inc. has come to an arrangement to obtain Cycuity, Inc. Cycuity’s technology and knowledge strengthens Arteris’ current product portfolio, allowing engineers to better understand and improve security while transmitting data in chiplets and SoCs.

Avalue Technology Inc. announced the ECM-ASL3 3.5-inch industrial single-board computer compatible with Intel Alder Lake-N, Amston Lake, and even Twin Lake platforms permitting rapid upgrades to product lines with minimal adjustments. The solution is ideal for edge AI, smart manufacturing, automation, automotive equipment and medical monitoring.

APLEX Technology Inc. released its NuTAM series presenting the stainless-steel, fanless touch panel PC NuTAM-9E leveraging Intel Core Ultra 5/7 processors. Built on the Intel 4 compute tile technology, the Core Ultra features a hybrid architecture of Performance-cores (P-cores) and Efficient-cores (E-cores), integrated CPU, Intel Arc GPU, and NPU capabilities. The solution comes in three display sizes including 15”, 17”, and 21.5” TFT-LCD.

RunSafe Security recently released its 2025 report, AI in Embedded Systems: AI is Here. Security Isn’t. The report focuses on how AI use is expanding across embedded software development. It offers insights into what the data indicates for engineering, product, and security leaders who are integrating AI into workflows.

EMASS publicized that it is collaborating with Semtech to offer low-power edge AI solutions integrated with LoRaWAN connectivity. EMASS’s ECS-DoT AI-enabled system-on-chips (SoCs) will integrate Semtech’s LoRa transceivers, supporting long-range, battery-efficient intelligence for industrial, IoT, and other connected applications. The systems are expected to process data locally, reduce network load, and deliver actionable insights in real time, even in power-constrained environments.

AAEON introduced the fanless embedded AI system, its BOXER-8651AI-PLUS leveraging either an 8GB or 16GB NVIDIA Jetson Orin NX module with Super Mode. The platform manages up to 157 TOPS of AI performance alongside NVIDIA Jetpack 6.2 support.

Axiomtek introduced its mBOX603 powered by 13th/12th Generation Intel Core processors (i3 to i9) including integrated high-speed DDR5 memory with ECC support. It is a medical edge platform engineered to accelerate AI-assisted diagnostics, imaging workflows, and real-time clinical operations while delivering the performance and stability required for CT/MRI reconstruction, EMR processing, and intelligent nursing applications.

albatron.ai launched its first embedded AI computing system, the TALO-25000, powered by the NVIDIA Jetson AGX Orin and engineered to deliver enhanced AI performance for mission-critical industrial applications. The system supports up to 275 TOPS AI performance utilizing Arm Cortex-A78AE CPU and Ampere GPU ideal for industrial automation and robotic intelligence.

Navitas Semiconductor and Cyient Semiconductors are collaborating to expand the proclivity of GaN technology in India and establish a complete end-to-end GaN ecosystem. Navitas Semiconductor and Cyient Semiconductors goal is to design GaN products, digital and mixed signal ICs, as wells as GaN based system modules. The target markets are India’s AI data centers, electric mobility, performance computing, energy grid infrastructure, and industrial electrification.

Toradex introduced two new Computer on Module (CoM) families, OSM and Lino. The additions extend Toradex’s portfolio with modules leveraging NXP i.MX 93 and i.MX 91 processors including models OSM iMX93, OSM iMX91, Lino iMX93, and Lino iMX91.

MosChip Technologies is now supporting EMASS’s RISC-V based ECS-DoT Edge AI System-on-Chip (SoC). It integrates dual neural accelerators and 4MB of on-chip memory. The SoC facilitates real-time, milliwatt-class inference for vision, audio, and sensor workloads without dependance on the cloud. The ultra-low-power chip provides always-on AI capabilities for drones, wearables, healthcare trackers, and industrial monitoring systems.

XELA Robotics announced it has integrated its uSkin sensors into a Tesollo DG-5F five-fingered human sized robotic hand with independent joint control. Due to the integration of XELA Robotics’ tactile sensors, the hand acquired a human-like sense of touch without changing its original size.

IBASE Technology Inc. introduced its MAF801 Edge AI platform powered by 14th/13th/12th Gen Intel Core processors offering dedicated GPU expansion slots to meet the computational demands of AI applications including industrial automation, machine vision, intelligent robotics, and high-density AIoT.

Solid Sands B.V. recently announced that it is acquiring Plum Hall technology and test suites. According to the company, the acquirement will allow Solid Sands the ability to extend its market value and open new corridors for growth while delivering innovative solutions.

AAEON introduced its COM-ARHC6, a COM Express Type 6 Compact Size module (95mm x 95mm) leveraging the Intel Core Ultra Processors (Series 2) platform (formerly Arrow Lake) including the Intel Core Ultra 9 Processor 285H, Intel Core Ultra 7 Processor 255H, and Intel Core Ultra 5 Processor 225H offering up to 99 TOPs of AI performance.

NEXCOM International and Stereolabs publicized a new partnership aiming to deliver cutting-edge AI vision solutions for B2B organizations across mobility, robotics, and industrial automation sectors. The collaboration will see the integration of Stereolabs’ ZED X series cameras with NEXCOM’s ATC series Edge AI computers.

Hilscher announced its latest embedded module, the comX 90, designed for next-generation communication interfaces utilized in industrial devices. Within a compact form factor, the module combines multiprotocol communication, integrated security functions, and IIoT capability.