Embedded Computing Design

During its stay at embedded world Germany 2026, BIWIN Storage Technology Co., Ltd. (BIWIN) will be in Booth 1-140 demonstrating its BIWIN TAU208 UFS 3.1 automotive-grade storage designed for performance and reliability in harsh environments.

Munich, Germany. TASKING acquired LDRA last year, and on its first anniversary of the procurement, has announced its TASKING toolchain. By effectively integrating LDRA and TASKING competences, the toolchain delivers complete end-to-end compile, debug, and test capabilities.  With the help of AI, the solution fast-tracks the development of real-time embedded systems with built-in safety and security in automotive, aerospace and defense, industrial, and robotics.

Circuit Mind published independent, data-supported research revealing AI-powered automation is driving measurable gains in electronics design workflows. Contained within is a peer-reviewed assessment by Los Alamos National Laboratory, as well as commercial engineering teams utilizing AI to speed up circuit architecture innovation, schematic generation, and initial verification.

Vecow will attend embedded world Germany and invites visitors to Hall 3, Stand 3-259 to see its Edge AI demonstrations under the theme "Powering the Future of Intelligence". On display will be high-performing AI engines driven by the latest Intel, NVIDIA, and Qualcomm technology.   

At this years embedded world Germany, Virscient (Booth 4-549) will display its portfolio of next-generation wireless connectivity and audio solutions. The company’s global representatives will be available to share their technical expertise in embedded systems, principally in wireless connectivity, audio product development, and device certification.

MEMPHIS Electronic will be in Hall 1, Booth 340 from March 10–12, 2026 at embedded world Germany. It will share rare and timely insights into the memory market and availability trends from more than 18 global memory manufacturers. These insights are vital for engineering and purchasing teams to facilitate informed decisions about future designs or sourcing strategies.

MiTAC Digital Technology (MDT) Corp. will exhibit its portfolio of industrial Edge computing products engineered to support modern data processing and AI workloads during embedded world Germany between March 10–12, 2026. MiTAC’s booth location will be Hall 3 Stand 3-358 where the company will demonstrate the way its solutions are designed to enable flexibility in how software and system architectures are implemented.

IBASE Technology Inc. introduced a 3.5 inch AI Edge Board, the IB301, leveraging the AMD Ryzen Embedded 8000 Series processor with up to eight cores and 16 threads. It delivers multi-threaded performance for real-time analytics, machine vision, industrial automation, smart retail, and AI inference at the edge.

Eschborn, Germany. Intelligent Memory (IM) announced the immediate availability of its industrial‑grade SD and microSD cards in 512MB, 1GB, and 2GB. Its SD devices are designed for embedded and industrial applications that don’t require high densities, but data reliability and durability.

The Zephyr Project announced new Silver members joining its ecosystem including Chengdu Jingrong Lianchuang Technology, Embedd, Savoir-faire Linux, SevenLab and Schneider Electric. For better collaboration across embedded applications and edge computing, BeagleBoard.org and openEuler are becoming Associate members.

Enclustra will be located at Booth 3A-331 during this year's embedded world Germany where it will highlight its next-generation FPGA and SoC innovations. The booth will host an interactive Enclustra Product Wall, highlighting the latest Andromeda RFSoC and SoC modules, including the powerful Andromeda XRU50, the newly introduced XRU30 for scalable, high-performance RF applications, and the Andromeda XVE70 based on AMD Versal SoC for advanced edge AI and signal processing.

Avalue Technology will be exhibiting during embedded world 2026 in Nuremberg, Germany, at Booth 3-465 where it will demonstrate its innovations under the motto “Empowering the Edge, Integrating the Future”. Highlighted will be the company’s Edge AI, HPC (high-performance computing), and embedded computing platforms enabling efficient, reliable, and long-term maintainable smart edge architectures.

ARBOR Technology is expected to demonstrate its innovations at embedded world Germany from March 10–12, 2026 in Nuremberg, Germany. ARBOR Technology’s Booth, No. 3-364, will be centered on the theme of “From Edge to Action.” Highlighted at the booth will be its COM-HPC modules and edge AI computing solutions ideal for data-driven actions across medicine and intelligent transportation applications. Booth demonstrations will include embedded products powered by Intel, NVIDIA, and AMD.

While at embedded world Germany, Linutronix will exhibit its first flexibly adaptable and real-time-capable Linux platform, IGLOS (Industrial Grade Linux Operating System), where security is the foundation of a TÜV SÜD–certified product aligned with IEC 62443-4-2. The platform offers a thorough security architecture with secure boot, mandatory access control, firewall, memory integrity and encryption, audit logging, and a secure OTA update mechanism.

Texas Instruments and Silicon Labs publicized that the two companies have signed a decisive arrangement in which Texas Instruments will obtain Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.

TouchNetix introduced the AX24A, further expanding its aXiom portfolio. The AX24A is a touch and force sensing controller designed for industrial, automotive, and entertainment use cases supporting button features as well as force sensing behind conductive surfaces. It delivers innovative sensing abilities in an efficient 40-pin QFN package supporting flexibility and performance. Enabled is up to 22 touch/force buttons, supporting designers in creating native and touch solutions.

Variscite introduced a series of System on Modules (SoMs)/Computer on Modules (CoMs) that is compliant with the Smart Mobility Architecture (SMARC) interface standard. The initial series begins with the NXP i.MX 8M Plus processor-powered VAR-SMARC-MX8M-PLUS delivering NXP’s 1.8GHz Quad Cortex-A53 with 800MHz Cortex-M7 real-time co-processor that combines AI/ML abilities and an advanced Image Signal Processor (ISP) vision system.

The demand for always-on Edge AI workloads is not going away. With the need for continuous processing creating a constant challenge, many system designers must compromise between responsiveness, accuracy, and battery life. To solve this challenge, Innatera has developed Pulsar, a brain-inspired solution enabling pattern recognition that alters how sensor data is processed.

In Hall 1, booth 320 at embedded world Germany (March 10-12, 2026), SECO will demonstrate its fully functioning smart vending/kiosk solution based on the Clea Vend cloud telemetry platform and the KarL4 contactless payment terminal enabling edge-to-cloud connectivity for meaningful insights through ongoing analysis of transactions and usage behavior.

Vodafone IoT is partnering with Skylo Technologies, Inc. to deliver Non-Terrestrial Network (NTN) Narrowband Internet of Things (NB-IoT) satellite connectivity services to customers. The initial phase will see the companies collaborate to test the technology in hopes of offering a full commercial service soon.